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DiStar Esthete 2.0 Diamond Blade

DiStar Esthete 2.0 Wet Diamond Blade

by DiStar
SKU 10216025019
Save 32% Save 32%
$64.33
$64.33 - $72.18
$64.33
$43.75
$43.75 - $49.09
$43.75
Size: 4.5" (7/8", 22.23mm Arbor)

The DiStar Esthete 2.0 is a precision finishing blade for the cuts that show. Its ultra-thin 1.1 mm diamond layer takes such a fine kerf that chipping drops to near zero, and the see-through core lets you track the cut line as you go — the difference between a professional edge and an amateur one on exposed tile.

Wet or dry, your call. Run it dry on a standard 5/8"-11 angle grinder for quick, low-setup cuts on the jobsite, or run it wet in the shop when you want maximum cooling and the cleanest possible edge.

More Details

Built for high-precision wet or dry cutting of ceramic, glazed porcelain, and other hard tile on corded or cordless 4.5"–5" angle grinders.

  • Diameter: 4.5" (115 mm) and 5" (125 mm)
  • Diamond layer thickness: 0.043" (1.1 mm) ultra-thin
  • Bore: 7/8" (22.23 mm)
  • Cooling: Wet or dry — flexible for shop or jobsite
  • Core: See-through design for cut-line visibility
  • Grinder fit: Corded or cordless 5/8"-11 angle grinders
  • Application: Ceramic tile, glazed porcelain gres, and other hard, dense tile
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Shipping Policy

Refund & Return Policy

DiStar Esthete 2.0 Ultra-Thin Diamond Blade — Chip-Free Precision, Wet or Dry

When the cut edge will be seen — a decorative backsplash, a trimmed feature tile, an exposed corner — there's no room for chip-out. The Esthete 2.0 is built for exactly that. The ultra-thin 1.1 mm layer reduces cutting force, and less force means less of the stress and vibration that start microchips at the edge.

The see-through core is the detail pros notice first: you can see the line you're following, which keeps detailed layouts and decorative cuts accurate. Run it dry for speed and a clean, low-mess workflow, or feed water when you want the coolest cut and the most refined edge on premium material — the flexibility to work the same blade on site or in the shop.

The 2.0 improves on the original Esthete with higher diamond concentration and a tougher bond, so it holds edge quality longer before the diamond layer wears down — a difference high-volume installers feel within a few jobs.

Why Tile Pros Choose It

  • Near-zero chipping: The ultra-thin 1.1 mm kerf cuts with minimal force for finish-grade edges.
  • See-through core: Track the cut line for accurate detailed and decorative work.
  • Wet or dry: Dry for low-setup jobsite cuts, wet for maximum cooling and the finest edge.
  • Cordless-friendly: Low drag suits battery grinders and extends runtime.
  • Longer life than the original: Higher diamond concentration and a tougher bond.
  • Built for visible cuts: The blade to reach for when chip-out isn't acceptable.

Usage tip: Light, controlled pressure gives the cleanest edge — let the thin kerf do the work. Feed water when you want the coolest, most refined cut.